Main application: This machine is mainly suitable for double-sided grinding or polishing of silicon wafers, quartz wafers, sapphire, lithium niobate, optical crystals, glass, ceramics and other thin metals or non-metals.
1. Adopt AC frequency conversion motor drive, soft start, soft stop, stable and reliable.
2. The cylinder's inclined surface lifting ring gear is very stable, and the ring gear and sun gear are effectively used.
3. The large-size design of the transmission shaft enhances the rigidity of the shaft, thereby eliminating jitter caused by insufficient rigidity.
1. Size of the upper plate (MM): φ968 × φ391 × 40mm
Lower plate size (MM): φ968 × φ391 × 35mm
2. Ideal grinding diameter (MM): φ270mm
3. Cruise ship parameters: DP12, Z = 153.
4. Number of cruise ships: 6
5.Rotary speed of lower grinding disc (rpm): 0 ~ 60rpm
6. Upper cylinder lifting cylinder bore: φ125mm
7. Stroke of upper cylinder: 450mm
8. Gear ring lifting stroke: 25mm
9.Safety device forward and backward stroke: 30mm
10. Main motor: 3 phase 11kw 1450rpm
11, polishing circle setting range: 0-9999s
12. Air source pressure: 0.5-0.6Mpa
13. Working pressure: 300kg
14. Installed capacity: about 12KVA
15. Overall dimensions of the equipment (MM): 1698 × 1155 × 2547mm
16. Weight (KG): ~ 2500kg