Main application: This machine is mainly suitable for double-sided grinding of quartz wafers, optical crystals, SMD surface mount crystals, glass and other fragile metal or non-metal materials, especially for double-side grinding or polishing of high-frequency wafers.
1. Grinding disc diameter (MM): φ380 × φ148 × 20
2. Ideal grinding diameter (MM): φ100
3. Parallelism of machined parts: 0.1U (φ10)
4. Cruise ship parameters: British DP12, Z = 66
5. Number of cruise ships: 5
6. Grinding thickness: 0.05mm (φ10)
7. Host power: 750W (Dc)
8.Rotary speed of lower grinding disc (rpm): 0 ~ 60
9. Sand pump power: 90W
10. Quicksand form: cycle or drip
11. Equipment Dimensions (MM):
700 × 1000 × 1700
12. Weight (KGS): 630
1. DC motor drive, soft start, soft stop, stable and reliable, small impact.
2. The oil pressure lifting ring gear is very stable. There is a gasket under the sun gear to adjust the position, and the ring gear and the sun gear are effectively used.
3. The upper plate is set to slow down, which effectively prevents the crushing of thin and brittle workpieces.
4. Through the use of electronic preset counters, the number of grinding cycles and requirements can be accurately controlled.
5. Trimming disc can be used to trim the grinding disc.
6, can be connected with ALC (frequency monitor).