Main application: This machine is mainly used for double-sided grinding or polishing of silicon or non-metallic wafers such as silicon wafers, quartz wafers, SMD surface mount crystals, optical crystals, glass, lithium niobate, and ceramic wafers.
1. Grinding disc diameter (MM): φ622 × φ218 × 25
2. Ideal grinding diameter (MM): φ200
3. Planar parallelism of machined parts: 0.15U (φ10)
4. Cruise ship parameters: British DP12, Z = 108
5. Number of cruise ships: 5
6. Grinding thickness: 0.1mm (φ10)
7. Host power: 4KW (grinding) (frequency conversion) 5.5KW (polishing) (frequency conversion)
8.Rotary speed of lower grinding disc (rpm): 0 ~ 60
9. Sand pump power: 120W
10. Quicksand form: cycle or drip
11. Equipment Dimensions (MM):
1000 × 1350 × 2200
12. Weight (KGS): ~ 2200
1. The machine adopts touch screen and PLC program control.
2. Adopt AC frequency conversion motor drive, soft start, soft stop, stable and reliable, small impact.
3. The hydraulic ring gear is very stable. There are shims under the sun gear to adjust the position, and the ring gear and sun gear are effectively used.
4. The equipment can perform pressure control independently, and the pressure, the machine speed, the number of revolutions and the speed ratio setting under this pressure state can be programmed and controlled according to the process requirements.
5. Trimming disc can be used to trim the grinding disc.
6, can be connected with ALC (frequency monitor)
Grinder Manufacturer: YL2M9B (IV) Grinder Product Technical Introduction